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BGA/Device Underfill
Processes
Assembly Cleaning
Automated Optical Inspection
BGA/Device Underfill
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Bonding/Coating
Circuit Card Assembly
Component Placement
Material Dispensing
Pin Thru Hole Assembly
Reflow Soldering
Secondary Assembly
Solder Paste
Specialized Rework
X-Ray Inspection
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BGA/Device Underfill
Teledyne EMS has highly controlled automated processes for BGA underfill
Calibrated dispense volume
Vision alignment
BGA underfill processes have been qualified by multiple major aerospace primes
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